Thermaltake CL-P0326 Datenblatt PDF herunterladen

UYHGFRDESAZ

Advanced Engineering by Thermaltake

Unit: mm

REVISION A. 2005.12

www.thermaltake.com

[email protected]

Fan Dimension : ∅ 90x90x25 mm

Heat Sink Dimension : 89.5x89.5x45 mm

Rated Voltage : 12V

Rated Current : 0.03 AMP

Fan Speed : 4200RPM

Air Flow : 71.79CFM (Duty cycle at 100%)

Static Pressure: 7.23 mm H

O (Duty cycle at 100%)

Max. Noise : 44 dB (Duty cycle at 100%)

Bearing Type : 1 Ball 1 Sleeve Bearing

Life Expectation : 40,000 hrs in 25℃

Connector : 4Pin PWM

Thermal Interface: TIC-1000A

Weight: 540g

Thermal Resistance: R=0.31 ℃/W

P/N : CL-P0326

Application for Intel LGA775 130W

Solution

SPECIFICATION

Back Plate

Spring screw

Al extrusion with Cu core

FEATURES:

-Application for Intel LGA775 130W Solution.

-Aluminum extrusion with Copper core inserted.

-The fourth fan pin has PWM (Pulse Width

Modulation) an speed control function: decrease

energy consumption, reduces acoustics noise and

increase fan performance.

-Plastic back plate & spring screw.

-TIC-1000A interface material perform well.

DIMENSION

THERMAL PERFORMANCE

9025 circle fan

0 10203040506070

HEAT DISSIPATED - WATTS

CHIP TEM PERATURE(Tc)

RISE ABOVE AMBIENT -

℃

UYHGFRDESAZ 1
P/N : CL-P0326 1

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UYHGFRDESAZAdvanced Engineering by ThermaltakeAdvanced Engineering by ThermaltakeUnit: mmREVISION A. 2005.12www.thermaltake.comthermaltake@thermaltake

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